1) Signal amplifier is built into the image sensor IC in order to increase immunity to external noise. 2) The LED light source is mounted on the same substrate as the sensor chip which allows packaging of the device with lighter weight and smaller size. 3) Employing low voltage driving sensor enables 3.3V drive (3.3V to 5V for MB90 Series) which is identical to the ASIC. 4) The ceramic substrate is used for excellent dimensional accuracy and thermal stability. 5) With the proprietary prism, the.