Part number: FBGA
Manufacturer: STATS ChipPAC
File Size: 589.04KB
Download: 📄 Datasheet
Description: Fine Pitch Ball Grid Array
Part number: FBGA
Manufacturer: STATS ChipPAC
File Size: 589.04KB
Download: 📄 Datasheet
Description: Fine Pitch Ball Grid Array
* Thin, lightweight, space saving package
* Flexible body sizes range from 4mm x 4mm to 23mm x 23mm
* 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch
* Eutectic.
The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. Lea.
STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher den.
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