FBGA - Fine Pitch Ball Grid Array

FBGA Datasheet Preview — Preview of FBGA PDF

Datasheet Details

Part number	FBGA
Manufacturer	STATS ChipPAC
File Size	589.04 KB
Description	Fine Pitch Ball Grid Array
Datasheet	FBGA_STATSChipPAC.pdf

FBGA Product details

Description

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals.

Features

Thin, lightweight, space saving package.
Flexible body sizes range from 4mm x 4mm to 23mm x 23mm.
0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch.
Eutectic & Pb free solder balls.
Green package available.
Multiple routing layers and dedicated ground/power planes available for improved electrical performance.
BT laminate materials (2 and 4 metal layers).
JEDEC standard compliant.

📁 FBGA Similar Datasheet

FBGA96T.5-DC144 - FBGA96T.5-DC144 (TopLine)

Other Datasheets by STATS ChipPAC

FBGA-SD - Fine Pitch Ball Grid Array

Published: Oct 17, 2007 |