FBGA Fine Pitch Ball Grid Array

Description

www.DataSheet4U.com FBGA Fine Pitch Ball Grid Array * Array molded, cost effective, space saving package solution * Available in 1.40.
STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array.

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FBGA Datasheet Preview — Preview of FBGA PDF

Datasheet Specifications

Part number: FBGA
Manufacturer: STATS ChipPAC
File Size: 589.04 KB
Datasheet: FBGA_STATSChipPAC.pdf
Description: Fine Pitch Ball Grid Array

Features

* Thin, lightweight, space saving package
* Flexible body sizes range from 4mm x 4mm to 23mm x 23mm
* 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch
* Eutectic & Pb free solder balls
* Green package available
* Multiple routing layers and dedicated ground/p

Applications

* The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. Lead free and halogen free compatible material sets are available. STATS ChipPAC’s FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (

FBGA Distributors

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FBGA Fine Pitch Ball Grid Array STATS ChipPAC

STATS ChipPAC FBGA-like datasheet

FBGA-SD