FBGA Datasheet - STATS ChipPAC

FBGA Fine Pitch Ball Grid Array

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package’s reduced outline and thickness and higher density options make it an ideal advanced technology .

FBGA Features

* Thin, lightweight, space saving package

* Flexible body sizes range from 4mm x 4mm to 23mm x 23mm

* 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch

* Eutectic & Pb free solder balls

* Green package available

* Multiple routing layers and dedicated ground/p

FBGA Datasheet (589.04 KB)

FBGA Datasheet Preview — Preview of FBGA PDF

Datasheet Details

Part number:

FBGA

Manufacturer:

STATS ChipPAC

File Size:

589.04 KB

Description:

Fine pitch ball grid array.

📁 Related Datasheet

FBGA-SD Fine Pitch Ball Grid Array (STATS ChipPAC)

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TAGS

FBGA Fine Pitch Ball Grid Array STATS ChipPAC

FBGA Distributor