FBGA-SD Fine Pitch Ball Grid Array

Description

www.DataSheet4U.com FBGA-SD Fine Pitch Ball Grid Array - Stacked Die * FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing fle.
STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages.

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FBGA-SD Datasheet Preview — Preview of FBGA-SD PDF

Datasheet Specifications

Part number: FBGA-SD
Manufacturer: STATS ChipPAC
File Size: 589.36 KB
Datasheet: FBGA-SD_STATSChipPAC.pdf
Description: Fine Pitch Ball Grid Array

Features

* 2 die to 7 die stack with spacer capability
* 5 x 5mm to 23 x 23mm body size
* Package height at 1.0, 1.2, 1.4 and 1.7mm max.
* Flexible die stacking options (“pyramid,” “same die,” etc. )
* 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball

Applications

* where Digital, Flash, SRAM, PSRAM and Logic are stacked into a single package. APPLICATIONS
* Suitable for a variety of applications including memory integration (ASIC or Logic)
* Chipset integration (Analog/Digital), mixed technologies integration (Baseband/RF)
* Handheld p

FBGA-SD Distributors

📁 Related Datasheet

FBGA96T.5-DC144

📌 All Tags

FBGA-SD Fine Pitch Ball Grid Array STATS ChipPAC

STATS ChipPAC FBGA-SD-like datasheet

FBGA