FBGA-SD - Fine Pitch Ball Grid Array
STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages.
Tape versions of VFBGA-SD and TFBGA-SD are also available.
STATS ChipPAC’s chip stack technology offers the flexibility of stacking 2 to 7 die in a single package.
D
www.DataSheet4U.com FBGA-SD Fine Pitch Ball Grid Array - Stacked Die FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance Available in 1.4mm (LFBGA-SD), 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package thickness Stacking of die allows for more functionality in an array molded, cost effectiv
FBGA-SD Features
* 2 die to 7 die stack with spacer capability
* 5 x 5mm to 23 x 23mm body size
* Package height at 1.0, 1.2, 1.4 and 1.7mm max.
* Flexible die stacking options (“pyramid,” “same die,” etc.)
* 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball
