FBGA-SD Datasheet, Array, STATS ChipPAC

FBGA-SD Features

• Array
• 2 die to 7 die stack with spacer capability
• 5 x 5mm to 23 x 23mm body size
• Package height at 1.0, 1.2, 1.4 and 1.7mm max.
• Flexible die stacking o

PDF File Details

Part number:

FBGA-SD

Manufacturer:

STATS ChipPAC

File Size:

589.36kb

Download:

📄 Datasheet

Description:

Fine pitch ball grid array. STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages

FBGA-SD Application

• Applications where Digital, Flash, SRAM, PSRAM and Logic are stacked into a single package. APPLICATIONS
• Suitable for a variety of applic

TAGS

FBGA-SD

STATS ChipPAC

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