FBGA-SD Datasheet - STATS ChipPAC

FBGA-SD, Fine Pitch Ball Grid Array

www.DataSheet4U.com FBGA-SD Fine Pitch Ball Grid Array - Stacked Die * FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing fle.
STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages.

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FBGA-SD_STATSChipPAC.pdf

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Datasheet Details

Part number:

FBGA-SD

Manufacturer:

STATS ChipPAC

File Size:

589.36 KB

Description:

Fine Pitch Ball Grid Array

Features

* 2 die to 7 die stack with spacer capability
* 5 x 5mm to 23 x 23mm body size
* Package height at 1.0, 1.2, 1.4 and 1.7mm max.
* Flexible die stacking options (“pyramid,” “same die,” etc. )
* 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball

Applications

* where Digital, Flash, SRAM, PSRAM and Logic are stacked into a single package. APPLICATIONS
* Suitable for a variety of applications including memory integration (ASIC or Logic)
* Chipset integration (Analog/Digital), mixed technologies integration (Baseband/RF)
* Handheld p

FBGA-SD Distributors

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FBGA-SD Fine Pitch Ball Grid Array STATS ChipPAC

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