Datasheet Details
Part number:
FBGA-SD
Manufacturer:
STATS ChipPAC
File Size:
589.36 KB
Description:
Fine Pitch Ball Grid Array
Features
* 2 die to 7 die stack with spacer capability
* 5 x 5mm to 23 x 23mm body size
* Package height at 1.0, 1.2, 1.4 and 1.7mm max.
* Flexible die stacking options (“pyramid,” “same die,” etc.)
* 0.5mm to 1.0mm ball pitch, Eutectic and Lead-free solder ball