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M53231600BE0 Datasheet

Manufacturer: Samsung Semiconductor
M53231600BE0 datasheet preview

Datasheet Details

Part number M53231600BE0
Datasheet M53231600BE0_SamsungSemiconductor.pdf
File Size 545.95 KB
Manufacturer Samsung Semiconductor
Description (M53231600BE0/BJ0-C) DRAM Module
M53231600BE0 page 2 M53231600BE0 page 3

M53231600BE0 Overview

The Samsung M53231600BE0/BJ0-C is a 16Mx32bits Dynamic RAM high density memory module. The Samsung M53231600BE0/BJ0-C consists of eight CMOS 16Mx4bits DRAMs in SOJ packages mounted on a 72-pin glass-epoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM.

M53231600BE0 Key Features

  • Part Identification
  • M53231600BE0-C(4K cycles/64ms Ref, SOJ, Solder)
  • M53231600BJ0-C(4K cycles/64ms Ref, SOJ, Gold)
  • Extended Data Out Mode Operation
  • CAS-before-RAS & Hidden Refresh capability
  • RAS-only refresh capability
  • TTL patible inputs and outputs
  • Single +5V±10% power supply
  • JEDEC standard PDpin & pinout
  • PCB : Height(1250mil), double sided ponent
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