K4H560838F-TCC4, K4H560838F-TC Datasheet - Samsung semiconductor

K4H560838F-TCC4, K4H560838F-TC, 256Mb F-die DDR400 SDRAM Specification

DDR SDRAM 256Mb F-die (x8, x16) DDR SDRAM 256Mb F-die DDR400 SDRAM Specification Revision 1.1 Rev.1.1 August.2003 DDR SDRAM 256Mb F-die (x8, x16.
DDR SDRAM 16Mb x 16 32Mb x 8 VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 NC VDDQ LDQS NC VDD NC LDM WE CAS RAS CS NC BA0 BA1 AP/A10 A0 A.

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K4H560838F-TC_Samsungsemiconductor.pdf

K4H560838F-TCC4 Datasheet Preview — This datasheet PDF includes multiple part numbers: K4H560838F-TCC4, K4H560838F-TC. Please refer to the document for exact specifications by model.

Datasheet Details

Part number:

K4H560838F-TCC4, K4H560838F-TC

Manufacturer:

Samsung semiconductor

File Size:

171.18 KB

Description:

256Mb F-die DDR400 SDRAM Specification

Note:

This datasheet PDF includes multiple part numbers: K4H560838F-TCC4, K4H560838F-TC.
Please refer to the document for exact specifications by model.

Features

* 200MHz Clock, 400Mbps data rate.
* VDD= +2.6V + 0.10V, VDDQ= +2.6V + 0.10V
* Double-data-rate architecture; two data transfers per clock cycle
* Bidirectional data strobe(DQS)
* Four banks operation
* Differential clock inputs(CK and CK)
* DL

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K4H560838F-TC 256Mb F-die DDR400 SDRAM Specification Samsung semiconductor

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