Part number:
KFH4G16Q2M
Manufacturer:
Samsung semiconductor
File Size:
2.59 MB
Description:
2gb onenand m-die.
KFH4G16Q2M_Samsungsemiconductor.pdf
Datasheet Details
Part number:
KFH4G16Q2M
Manufacturer:
Samsung semiconductor
File Size:
2.59 MB
Description:
2gb onenand m-die.
KFH4G16Q2M, 2Gb OneNAND M-Die
5.
Chapter 2.8.3 : Eliminated ’Top boot’ option.
6.
Chapter 2.8.12 & 2.8.16 & 3.8 : Added a.
comment about FSA & FCSA setting on Cache Read Operation 7.
Chapter 2.8.18 : Added acceptible command during busy on Unlock, Lock, Lock-tight, All block unlock and Erase suspend operation.
8.
Chapter 3.1 :
OneNAND2G(KFG2G16Q2M-DEBx) OneNAND4G(KFH4G16Q2M-DEBx) OneNAND8G(KFW8G16Q2M-DEBx) FLASH MEMORY www.DataSheet4U.com KFG2G16Q2M KFH4G16Q2M KFW8G16Q2M 2Gb OneNAND M-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.
ALL INFORMATION IN THIS DOCUME
KFH4G16Q2M Features
* including: xA BootRAM and bootloader xTwo independent bi-directional 2KB DataRAM buffers xA High-Speed x16 Host Interface xOn-chip Error Correction xOn-chip NOR interface controller This on-chip integration enables system designers to reduce external system logic and use high-density
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