Description
These miniature surface mount MOSFETs utilize a High Cell Density trench process to provide Low RDS(on) and ensure minimal power loss and heat dissipation.
Features
- Low RDS(on) provides higher efficiency and extends battery life.
- Low thermal impedance copper leadframe SC-59 saves board Space.
- Fast switching speed.
- High performance trench technology. SC-59
A
L
3
Top View
CB
12
KE
1
D F GH
3 2
J
REF. A B C D E F
Millimeter
Min. 2.70 2.25 1.30
1.00
Max. 3.10 3.00 1.70
1.40
1.70 2.30
0.35 0.50
REF. G H J K L
Millimeter
Min. Max. 0.10 REF. 0.40 REF. 0.10 0.20 0.45 0.55
0.85 1.15.
SMG2340N-SeCoS.pdf
