SEMIX302KD16S Datasheet - Semikron International

Features

* Terminal height 17 mm

* Chips soldered directly to isolated substrate Characteristics Symbol Diode VF V(TO) rT IRD Rth(j-c) Rth(j-c) Module Rth(c-s) Ms Mt a w 250 per chip per module to heat sink (M5) to terminals (M6) 3 2.5 0.045 5 5 5

* 9,81 K/W K/W Nm Nm m/s2 g Tj = 25 °C,