Features
* br>
* br>* Low inductive design
* Low inductive design* Press-Fit contact technology
* Press-Fit contact technology* Rugged mounting due to integrated
mounting clamps
* Rugged mounting due to integrated
mounting clamps* Heat transfer and insulation through
direct copper bonded aluminium oxide ceramic (DBC)
* Heat transfer and insulation through
direct copper bonded aluminium oxide ceramic (DBC)* Trench4 IGBT technology
* Trench4 IGBT technology* Robust and soft switchi
* Robust and soft switchi
Applications
* Motor drives
* Motor drives* Servo drives
* Servo drives* Air conditioning
* Air conditioning* Auxiliary Inverters
* Auxiliary Inverters* UPS
Absolute Maximum Ratings
Symbol Conditions
IGBT 1 VCES IC
IC
ICnom ICRM VGES
tpsc
Tj
Tj = 25 °C λpaste=0.8 W/(mK) Tj = 175 °C λpaste=2.5 W/(mK) Tj = 175 °C
Ts = 25 °C Ts = 70 °C
* UPS
Absolute Maximum Ratings
Symbol Conditions
IGBT 1 VCES IC
IC
ICnom ICRM VGES
tpsc
Tj
Tj = 25 °C λpaste=0.8 W/(mK) Tj = 175 °C λpaste=2.5 W/(mK) Tj = 175 °C
Ts = 25 °C Ts = 70 °C