GL390 - Thin Bow Type Resin Mold Package Infrared Emitting Diodes
GL390 Features
* 1. Thin bow type resin mold package (Resin area : 2.0 x 3.1 x 5.2 mm) 2. Low peak forward voltage ( GL390V) VFM : TYP. 1.9V at IFM=0.5A Thin Bow Type Resin Mold Package Infrared Emitting Diodes s Outline Dimensions (Unit : mm) φ 3.8 ± 0.3 φ 3.1 g1 Epoxy resin 0.1 2.0 + - 0.3 1 s Applications
