* to enhance thermal performance, to present a competitive alternative for high reliability applications. SOLDER PAD LAYOUT )
* mm A 7.32 B 1.78 C 3.94 Inches 0.288 0.070 0.155 Soldering temperature should be 260°C for a maximum of 10 seconds. PACKAGE MASS Gold Plated Solder Pad Finish
1N6626D3A Datasheet (360.62 KB)
1N6626D3A
TT
360.62 KB
Ultra fast recovery power rectifier.
ULTRA FAST RECOVERY POWER RECTIFIER
1N6626D3A / 1N6626D3B 1N6626D3C / 1N6626D3D
* High Reliability Screening Options Available.
* Hig.
📁 Related Datasheet
1N6626D3B ULTRA FAST RECOVERY POWER RECTIFIER (TT)
1N6626D3C ULTRA FAST RECOVERY POWER RECTIFIER (TT)
1N6626D3D ULTRA FAST RECOVERY POWER RECTIFIER (TT)
1N6626 ULTRA FAST RECTIFIERS (Digitron Semiconductors)
1N6626 HYPER FAST RECOVERY RECTIFIER (SSDI)
1N6626 ULTRA FAST RECOVERY GLASS RECTIFIERS (Microsemi)
1N6626 ULTRAFAST RECTIFIERS (Sensitron)
1N6626US SURFACE MOUNT ULTRA FAST RECOVERY GLASS RECTIFIERS (Microsemi)
1N6620 ULTRA FAST RECTIFIERS (Digitron Semiconductors)
1N6620 Ultra Fast Recovery Rectifier Diode (SEMTECH)
