* to enhance thermal performance, to present a competitive alternative for high reliability applications. SOLDER PAD LAYOUT )
* mm A 7.32 B 1.78 C 3.94 Inches 0.288 0.070 0.155 Soldering temperature should be 260°C for a maximum of 10 seconds. PACKAGE MASS Gold Plated Solder Pad Finish
1N6626D3C Datasheet (360.62 KB)
1N6626D3C
TT
360.62 KB
Ultra fast recovery power rectifier.
ULTRA FAST RECOVERY POWER RECTIFIER 1N6626D3A / 1N6626D3B 1N6626D3C / 1N6626D3D High Reliability Screening Options Available. Hig.
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