B5819WS Datasheet - Taiwan Semiconductor

B5819WS Schottky Diode

Green compound Green compound Document Number: DS_S1404015 Version: A14 Small Signal Product PACKAGE OUTLINE DIMENSIONS SOD-323 B5817WS/B5818WS/B5819WS Taiwan Semiconductor DIM. A B C D E F G H Unit (mm) Min Max 1.15 1.40 2.30 2.70 0.25 0.45 1.60 1.80 0.80 1.00 0.05 0.17 0.475 REF - 0.10 Unit.

B5819WS Features

* - Low Forward Voltage Drop - Surface mount device type - Moisture sensitivity level 1 - Pb free and RoHS compliant MECHANICAL DATA - Case: Bend lead SOD-323 package - High temperature soldering guaranteed: 260°C/10s - Weight: 4.3mg (approximately) SOD-323 APPLICATION - General purpose rectificati

B5819WS Datasheet (131.60 KB)