Description
The S172 feature:
The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications.Its low profile height (.370) and .100” grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required.The specially formed J-leads are pre-tinned to make the relays ideal for all types of surface-mount solder reflow processes.The basic design and internal structure are similar to Teledyne’s
Features
- and manufacturing techniques provide overall high reliability and excellent resistance to environmental extremes:.
- All welded construction.
- High force/mass ratios for resistance to shock and vibration.
- Unique uni-frame design providing high magnetic efficiency and
mechanical rigidity.
- Advanced cleaning techniques provide maximum assurance of
internal cleanliness.
- Precious metal alloy contact material with gold plating assures excellent
high curre.
S172-Teledyne.pdf