ZMM55-C27 Features
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
* Pb free product are available : 99% Sn above can meet Rohsenvironment substance directive request MINI-MELF/LL-34 .063(1.6) .055(1.4)DIA. Mechanical Data Case: Molded Glass MINI
Datasheet Details
ZMM55-C27, ZMM55-C2V4
UPM
830.95 KB
Surface mount zener diodes.
This datasheet PDF includes multiple part numbers: ZMM55-C27, ZMM55-C2V4.
Please refer to the document for exact specifications by model.
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