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FCSP0530ETR

chip scale packaging to deliver Schottky diodes

FCSP0530ETR Features

* Ultralow VF to footprint area Very low profile (< 0.6 mm ) Low thermal resistance Supplied tested and on tape and reel Designed for consumer level APPLICATIONS

* Reverse polarity protection Current ste

FCSP0530ETR General Description

FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made thro.

FCSP0530ETR Datasheet (119.19 KB)

Preview of FCSP0530ETR PDF

Datasheet Details

Part number:

FCSP0530ETR

Manufacturer:

Vishay ↗ Siliconix

File Size:

119.19 KB

Description:

Chip scale packaging to deliver schottky diodes.

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FCSP0530ETR chip scale packaging deliver Schottky diodes Vishay Siliconix

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