FCSP05H40ETR Datasheet (Vishay Siliconix) - chip scale packaging to deliver Schottky diodes

FCSP05H40ETR, chip scale packaging to deliver Schottky diodes

FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space.

The anode and cathode connections are made through

FCSP05H40ETR Features

* Ultralow VF to footprint area Very low profile (< 0.6 mm ) Low thermal resistance Supplied tested and on tape and reel Designed for consumer level APPLICATIONS

* Reverse polarity protection Current ste