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FCSP230LTR

Chip Scale Package Schottky Barrier Rectifier

FCSP230LTR Features

* Ultra low VF per footprint area

* Low leakage

* Low thermal resistance

* One-fifth footprint of SMA

* Super low profile (0.6 mm)

* Available tested on tape and reel RoHS COMPLIANT APPLICATIONS

* Reverse polarity protection FlipKY®

FCSP230LTR General Description

Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board space. The anode and cathode connections are made thr.

FCSP230LTR Datasheet (134.75 KB)

Preview of FCSP230LTR PDF

Datasheet Details

Part number:

FCSP230LTR

Manufacturer:

Vishay ↗ Siliconix

File Size:

134.75 KB

Description:

Chip scale package schottky barrier rectifier.

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TAGS

FCSP230LTR Chip Scale Package Schottky Barrier Rectifier Vishay Siliconix

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