FCSP230LTR Datasheet (Vishay Siliconix) - Chip Scale Package Schottky Barrier Rectifier

FCSP230LTR, Chip Scale Package Schottky Barrier Rectifier

Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board space.

The anode and cathode connections are made thr

FCSP230LTR Features

* Ultra low VF per footprint area

* Low leakage

* Low thermal resistance

* One-fifth footprint of SMA

* Super low profile (0.6 mm)

* Available tested on tape and reel RoHS COMPLIANT APPLICATIONS

* Reverse polarity protection FlipKY®