Description
The ADD-A-PAK generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
Features
- 175 °C TJ operation.
- Low forward voltage drop.
- High frequency operation.
- Low thermal resistance.
- UL approved file E78996.
- Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.
- Designed and qualified for industrial level.