Description
The ADD-A-PAK generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
Excellent thermal performances obtained by the usage of
exposed direct bonded copper substrate
High surge capability
Easy mounting on heatsink
ELECTRICAL DESCRIPTION Th
Features
- 175 °C TJ operation.
- Low forward voltage drop.
- High frequency operation.
- Low thermal resistance.
- UL approved file E78996.
- Designed and qualified for industrial level.
- Material categorization: For definitions of compliance
please see www. vishay. com/doc?99912.
VS-VSKJS209-150-Vishay.pdf
