SFM38L
Features
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to
Feaotputirmeizse board space.
- Low power loss, high efficiency.
- High current capability, low forward voltage drop.
- Batch process design, excellent power dissipation offers be- tte Hrigrehvseurrsgeelecaakpaagbeilictyu.rrent and thermal resistance.
- Lo- w Gpuroafridlerisnugrffaocr eovmeorvuonltteadgeappprolitceacttioionni.n order to op- tim Ulitzrea bhoigahrd-ssppeaecdes. witching.
- Hig- h Sciluicrroennet pciatapxaibail iptyla. nar chip, metal silicon junction.
- Su- pe Lrefads-tfrreeceopvaerrtystmimeeetfoernsvwiriotcnhminegntmalosdteanadpaprlidcsaotifon.
- High Ms Iu Lr-g Se Tc Du-r1r9e5n0t c0a/p2a2b8ility.
- Gla- s Rsop Ha Ssspirvoadtuecdt fcohr ippajcuknincgtiocond. e suffix "G"
- Mois Htuarloeg Seennfsreiteivpitryod Luecvtefol r1packing code suffix "H"
Mechanical data
- Epoxy : UL94-V0 rated flame retardant
M e- c...
