25N02KVZEIU Datasheet, Memory, Winbond

25N02KVZEIU Features

• Memory 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 8 3.4 Ba

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Part number:

25N02KVZEIU

Manufacturer:

Winbond

File Size:

2.51MB

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📄 Datasheet

Description:

3v 2g-bit slc qspinand flash memory. 6 2. FEATURES 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm 7 3.

TAGS

25N02KVZEIU

Winbond

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