* 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 8x6-mm 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Pin Configuration SOIC 300-mil 8 3.4 Pin Description SOIC 300-mil 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5-1 Ball Array) 9 3.6 Ball Description TFBGA 8x6-mm 9 4. PIN DESCRIPTI
W25N01JW
Winbond
1.85 MB
1.8v 1g-bit serial slc nand flash memory dual/quad spi.
W25N01JWxxIG/IT
1.8V 1G-BIT SERIAL SLC NAND FLASH MEMORY DUAL/QUAD SPI WITH 166MHZ STR & 80MHZ DTR BUFFER READ & CONTINUOUS READ
Release Date: October.
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