* 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration WSON 6x5-mm, WSON 8x6-mm 6 3.2 Pad Description WSON 6x5-mm, WSON 8x6-mm 6 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 7 3.4 Ball Description TFBGA 8x6-mm 7 4. PIN DESCRIPTIONS 8 4.1 Chip Select (/CS) 8 4.2 Seria
W25N01KVTBIR Datasheet (1.08 MB)
W25N01KVTBIR
Winbond
1.08 MB
3v 1g-bit slc qspinand flash memory.
W25N01KVxxIR
3V 1G-BIT SLC QSPINAND FLASH MEMORY WITH DUAL/QUAD SPI
Publication Release Date: January 06, 2022 Preliminary datasheet Revision A01
W25.
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