* 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS 7 3.1 Pad Configuration WSON 6x5-mm / 8x6-mm 7 3.2 Pad Description WSON 6x5-mm / 8x6-mm 7 3.3 Pin Configuration SOIC 300-mil 8 3.4 Pin Description SOIC 300-mil 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) 9 3.6 Ball Description TFBGA 8x6-mm 9
W25N512GVEIG Datasheet (1.35 MB)
W25N512GVEIG
Winbond
1.35 MB
3v 512m-bit serial slc nand flash memory.
W25N512GVxIG/IT
3V 512M-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ
Publication Release Date: November 21, 2018 .
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