* 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration WSON 8x6-mm 6 3.2 Pad Description WSON 8x6-mm 6 3.3 Pin Configuration SOIC 300-mil 7 3.4 Pin Description SOIC 300-mil 7 3.5 Pin Configuration PDIP 300-mil 8 3.6 Pin Description SOIC 150/208-mil, WSON 6x5-mm / USON 4x3-mm / PDIP 3
W25Q256FV
Winbond
2.47 MB
3v 256m-bit serial flash memory.
W25Q256FV
3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
Publication Release Date: February 26, 2016 Preliminary Revision I
W25Q256FV
Table.
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