* 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration 8x6-mm 6 3.2 Pad Description 8x6-mm 6 3.3 Pin Configuration SOIC 300-mil 7 3.4 Pin Description SOIC 300-mil 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) 8 3.6 Ball Description TFBGA 8x6-mm 8 4. PIN DESCRIPTIONS
W25Q512JVBIQ Datasheet (1.72 MB)
W25Q512JVBIQ
Winbond
1.72 MB
3v 512m-bit serial flash memory.
W25Q512JV
3V 512M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI
Publication Release Date: June 25, 2019 -Revision B
W25Q512JV
Table of Contents
1. GENER.
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