Part number:
W66CM2NQ
Manufacturer:
Winbond
File Size:
3.38 MB
Description:
2gb / 4gb lpddr4x.
* 5 3. ORDER INFORMATION 5 4. BALL ASSIGNMENT 6 4.1 Single-Die-Package (SDP) WFBGA 200 Ball Assignment 6 4.2 Dual-Die-Package (DDP) WFBGA 200 Ball Assignment 7 5. 5.1 5.2 BALL CONFIGURATION 8 Ball Description 8 Addressing Table 9 6. 6.1 BLOCK DIAGRAM 10 Block diagram of single chip 10
W66CM2NQ
Winbond
3.38 MB
2gb / 4gb lpddr4x.
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