CD40174BF - CMOS HEX D-TYPE FLIP-FLOP
Data sheet acquired from Harris Semiconductor SCHS104C Revised October 2003 The CD40174B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Dev.