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Features
General
• • • • • • • High-performance, Low-power secureAVR Enhanced RISC Architecture
– 137 Powerful Instructions (Most Executed in a Single Clock Cycle) Low Power Idle and Power-down Modes Bond Pad Locations Conforming to ISO 7816-2 ESD Protection to ± 6000V Operating Ranges: 2.7V to 5.5V Compliant with ICAO and FIPS201 Specifications, GSM and EMV2000 Specifications Available in Wafers, Contact Modules, Dual Interface Modules, Full Contactless Modules or Inlays and Industry-standard Packages
Contactless Mode
RF Contactless Interface with Full Support for ISO/IEC 14443 Type A and B Protocols Supply Voltage Clamp and Regulation Full-bridge Power Rectification On-chip Tuning Capacitance: 10 pF up to 120 pF 13.56 MHz Clock Extraction Internal Bus Maximum Frequency: 3.