CP630 - PNP Transistor

Central Semiconductor

Datasheet Details

Part number	CP630
Manufacturer	Central Semiconductor
File Size	475.85 KB
Description	PNP Transistor
Datasheet	CP630 Datasheet
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Full PDF Text Transcription

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PROCESS Power Transistor CP630 PNP - Silicon Darlington Transistor Chip www.DataSheet4U.com PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER EPITAXIAL PLANAR 80 x 80 MILS 8.0 MILS 18 x 27 MILS 34 x 34 MILS Al - 30,000Å Ti/Pd/Ag - 20,000Å 1,445 PRINCIPAL DEVICE TYPES CZT127 CJD127 R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CP630 Typical Electrical Characteristics R2 (22-March 2010) w w w. c e n t r a l s e m i .

Published: Jun 3, 2011 |