MMST5551 Overview
Key Features
- Epitaxial Planar Die Construction
- Ultra-Small Surface-Mount Package
- Complementary PNP Type: MMST5401
- Ideal for Low Power Amplification and Switching
- Totally Lead-Free & Fully RoHS Compliant (Notes 1 &
- Halogen and Antimony Free. “Green” Device (Note
- This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. Mechanical Data
- Package: SOT323
- Package Material: Molded Plastic. “Green” Molding Compound. UL Flammability Rating 94V-0
- Moisture Sensitivity: Level 1 per J-STD-020
