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DIM600M1HS17-PA500 - Half Bridge IGBT

Key Features

  • Trench Gate IGBT.
  • High Thermal Cycling.
  • Cu Base with Enhanced Al2O3 Substrates.
  • 10µs Short Circuit Withstand KEY.

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Datasheet Details

Part number DIM600M1HS17-PA500
Manufacturer DYNEX
File Size 643.74 KB
Description Half Bridge IGBT
Datasheet download datasheet DIM600M1HS17-PA500 Datasheet

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Replaces DS6329-2 TRENCH Gen5 TMOS DIM600M1HS17-PA500 Half Bridge IGBT Module DS6329-3 September 2021 (LN41204) FEATURES • Trench Gate IGBT • High Thermal Cycling • Cu Base with Enhanced Al2O3 Substrates • 10µs Short Circuit Withstand KEY PARAMETERS VCES VCE(sat) * (typ) IC (max) IC(RM) (max) 1700V 1.80V 600A 1200A * Measured at the auxiliary terminals APPLICATIONS • Wind Turbines • Power Charging Equipment • Smart Grid • High Reliability Inverters The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 1200V to 6500V and currents up to 2400A.