DIM600M1HS17-PA500 Overview
Replaces DS6329-2 TRENCH Gen5 TMOS DIM600M1HS17-PA500 Half Bridge IGBT Module DS6329-3 September 2021.
DIM600M1HS17-PA500 Key Features
- Trench Gate IGBT
- High Thermal Cycling
- Cu Base with Enhanced Al2O3 Substrates
- 10µs Short Circuit Withstand
- Measured at the auxiliary terminals