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BAS116LP3 - ULTRA-SMALL SURFACE MOUNT LOW LEAKAGE DIODE

Key Features

  • Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm).
  • Ultra-Low Profile Package (0.3mm).
  • Very Low Leakage Current.
  • Low Capacitance.
  • Ideal for Compact Battery Powered Portable Electronics.
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2).
  • Halogen and Antimony Free. “Green” Device (Note 3)  Mechanical Data.
  • Case: X3-DFN0603-2.
  • Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0.
  • Moisture.

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Full PDF Text Transcription (Reference)

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NEW PRODUCT BAS116LP3 ULTRA-SMALL SURFACE MOUNT LOW LEAKAGE DIODE Features  Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)  Ultra-Low Profile Package (0.3mm)  Very Low Leakage Current  Low Capacitance  Ideal for Compact Battery Powered Portable Electronics  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  Mechanical Data  Case: X3-DFN0603-2  Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminal Connections: Cathode Bar  Terminals: Finish Matte Tin Finish over Copper Leadframe  (Lead Free Plating). Solderable per MIL-STD-202, Method 208 e3  Weight: 0.