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DIM200MBS12-A000 - Bi-directional Switch Igbt Module

Key Features

  • s s s 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY.

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Datasheet Details

Part number DIM200MBS12-A000
Manufacturer Dynex Semiconductor
File Size 200.54 KB
Description Bi-directional Switch Igbt Module
Datasheet download datasheet DIM200MBS12-A000 Datasheet

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www.DataSheet4U.com DIM200MBS12-A000 DIM200MBS12-A000 IGBT Bi-Directional Switch Module Preliminary Information Replaces issue May 2002, version DS5543-1.3 DS5545-2.1 June 2002 FEATURES s s s 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VDRM (typ) VT (max) IC (max) IC(PK) ±1200V 4.3V 200A 400A APPLICATIONS s s s Matrix Converters Brushless Motor Controllers Frequency Converters 7(E2) 6(G2) 11(C2) 1(C2) 3(C1) 9(C1) 4(G1) 5(E1) 2(E1E2) The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 2400A.