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DIM200MLS12-A000 - Igbt Modules - Chopper

Key Features

  • I I I 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY.

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Datasheet Details

Part number DIM200MLS12-A000
Manufacturer Dynex Semiconductor
File Size 203.22 KB
Description Igbt Modules - Chopper
Datasheet download datasheet DIM200MLS12-A000 Datasheet

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The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com DIM200MLS12-A000 DIM200MLS12-A000 IGBT Chopper Module Replaces November 2002, version DS5553-1.1 DS5553-2 March 2003 FEATURES I I I 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES (typ) VCE(sat)* (max) IC (max) IC(PK) 1200V 2.2V 200A 400A *(measured at the power busbars and not the auxiliary terminals) APPLICATIONS I I I I I Choppers Motor Controllers Induction Heating Resonant Converters Power Supplies 7(E2) 6(G2) 11(C2) 1(A,C2) 2(E2) 3(K) The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configurations covering voltages from 600V to 3300V and currents up to 2400A.