EPC EPC2215
Power Transistor
| Part No. | EPC2215 |
|---|---|
| Datasheet | EPC2215 Download |
| Manufacturer |  EPC |
| Description | Power Transistor |
| Buy | Stock & Price |
MAXIMUM RATINGS
PARAMETER VDS Drain-to-Source Voltage (Continuous) Continuous (TA = 25°C) ID Pulsed (25°C, TPULSE = 300 µs) Gate-to-Source Voltage VGS Gate-to-Source Voltage TJ Operating Temperature TSTG Storage Temperature VALUE UNIT 200 V 32 A 162 6 V -4 -40 to 150 °C -40 to 150 Thermal Characteristics PARAMETER TYP UNIT RθJC Thermal Resistance, Junction-to-Case 0.5 RθJB Thermal Resistance, Junction-to-Board 2.5 °C/W RθJA Thermal Resistance, Junction-to-Ambient (Note 1) 52 Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board. See for details. EPC2215 eGaN® FETs are supplied only in passivated die form with solder bars. Die Size: 4.6 mm x 1.6 mmAPPLICATIONS
● DC-DC Converters● BLDC Motor Drives
● Sync Rectification for AC/DC and DC-DC
● Multi-level AC/DC Power Supplies
● Wireless Power
● Solar Micro Inverters
● Robotics
● Class-D Audio Benefits
● Ultra High Efficiency
● No Reverse Recovery
● Ultra Low QG
● Small F...
