DB3TG - 150mW Bi-directional Trigger Diodes

Datasheet Summary

Features

VBO : 32V Version.
Low break-over current.
DO-35 package (JEDEC).
Hermetically sealed glass.
Compression bonded construction.
All external surfaces are corrosion resistant and terminals are readily solderable.
RoHS compliant.
High reliability glass passivation insuring parameter stability and protection against junction contamination.
Terminal: Pure tin plated, lead free, solderable per MIL-STD-202, Method 208 gua.

Fairchild Semiconductor

📥 Download Datasheet

Datasheet Details

Part number	DB3TG
Manufacturer	Fairchild Semiconductor
File Size	154.66 KB
Description	150mW Bi-directional Trigger Diodes
Datasheet	DB3TG Datasheet
Additional preview pages of the DB3TG datasheet.

📁 Similar Datasheet

DB3TG - SILICON BIDIRECTIONAL DIAC (MCC)
DB3TG - DIAC (STMicroelectronics)
DB3TG - 150mW Bi-directional Trigger Diode (Taiwan Semiconductor)
DB3 - SILICON BIDIRECTIONAL DIACS (SEMTECH)
DB3 - SILICON BIDIRECTIONAL DIAC (MCC)
DB3 - 150mW Bi-directional Trigger Diode (Taiwan Semiconductor)
DB3 - DIAC (STMicroelectronics)
DB3 - TECHNICAL SPECIFICATIONS OF BIDIRECTIONAL DIODE THYRISTORS (DIACS) (Dc Components)
DB3 - Bidirectional Si-Trigger-Diodes (DIAC) (Diotec Semiconductor)
DB3 - SILICON BIDIRECTIONAL DIACS (HY ELECTRONIC)

Other Datasheets by Fairchild Semiconductor

DB3 - 150mW Bi-directional Trigger Diodes

Full PDF Text Transcription

Click to expand full text

DB3-DB3TG — 150mW Bi-directional Trigger Diodes DB3-DB3TG 150mW Bi-directional Trigger Diodes Features • VBO : 32V Version • Low break-over current • DO-35 package (JEDEC) • Hermetically sealed glass • Compression bonded construction • All external surfaces are corrosion resistant and terminals are readily solderable • RoHS compliant • High reliability glass passivation insuring parameter stability and protection against junction contamination.

Published: Aug 2, 2016 |