DB3TG Overview
Key Specifications
Mount Type: Through Hole
Pins: 2
Height: 2 mm
Length: 4.5 mm
Key Features
- VBO : 32V Version
- Low break-over current
- DO-35 package (JEDEC)
- Hermetically sealed glass
- Compression bonded construction
- All external surfaces are corrosion resistant and terminals are readily solderable
- RoHS compliant
- High reliability glass passivation insuring parameter stability and protection against junction contamination
- Terminal: Pure tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10 seconds September 2010 DO-35 Color Band Denotes Cathode
