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DB3TG - 150mW Bi-directional Trigger Diode

Download the DB3TG datasheet PDF. This datasheet also covers the DB3 variant, as both devices belong to the same 150mw bi-directional trigger diode family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • —Designed for through-Hole Device Type Mounting. —Hermetically Sealed Glass. —All external suface are corrosion resistant and terminals are readily solderable. —High reliability glass passivation insuring parameter stability and protection against junction contamination. —Pb free version and RoHS compliant Mechanical Data —Case :DO-35 Solder Hot Dip Tin (Sn) lead finish —Terminal: Pure tin plated, lead free. , solderable per MIL-STD-202, Method 208 guaranteed —High temperature soldering guarantee.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DB3-TaiwanSemiconductor.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Small Signal Diode DB3-DB3TG 150mW Bi-directional Trigger Diode DO-35 Axial Lead HERMETICALLY SEALED GLASS Features —Designed for through-Hole Device Type Mounting. —Hermetically Sealed Glass. —All external suface are corrosion resistant and terminals are readily solderable. —High reliability glass passivation insuring parameter stability and protection against junction contamination. —Pb free version and RoHS compliant Mechanical Data —Case :DO-35 Solder Hot Dip Tin (Sn) lead finish —Terminal: Pure tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed —High temperature soldering guaranteed: 260°C/10s —Marking : DB3/DB3TG —Weight : 0.1255 gram (approximately) D A B C Dimensions A B C D Unit (mm) Unit (inch) Min 0.45 3.05 25.4 1.53 Max 0.55 5.08 38.1 2.28 Min 0.