RFD16N06LESM Overview
Key Specifications
Package: DPAK
Mount Type: Surface Mount
Pins: 3
Height: 2.517 mm
Key Features
- rDS(ON) = 0.047Ω
- Temperature Compensating PSPICE® Model
- Can be Driven Directly from CMOS, NMOS, TTL Circuits
- Peak Current vs Pulse Width Curve
- UIS Rating Curve
- Related Literature
- TB334 “Guidelines for Soldering Surface Mount Components to PC Boards” Symbol D
