FDZ663P Description
Less than 16% of the area of 2 x 2 BGA Ultra-thin package: less than 0.4 mm height when mounted to PCB RoHS pliant Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ663P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal...
FDZ663P Key Features
- Max rDS(on) = 134 mΩ at VGS = -4.5 V, ID = -2 A
- Max rDS(on) = 171 mΩ at VGS = -2.5 V, ID = -1.5 A
- Max rDS(on) = 216 mΩ at VGS = -1.8 V, ID = -1 A
- Max rDS(on) = 288 mΩ at VGS = -1.5 V, ID = -1 A
- Occupies only 0.64 mm2 of PCB area. Less than 16% of the
- Ultra-thin package: less than 0.4 mm height when mounted to PCB
- RoHS pliant