LP1500 Description
AND APPLICATIONS DIE SIZE: 16.5X16.1 mils (420x410 µm) DIE THICKNESS: 3 mils (75 µm) BONDING PADS:.
LP1500 Key Features
- 31.5 dBm Output Power at 1-dB pression at 18 GHz
- 8 dB Power Gain at 18 GHz
- 28 dBm Output Power at 1-dB pression at 3.3V
- 45dBm Output IP3 at 18GHz
- 50% Power-Added Efficiency
- DESCRIPTION AND