LP3000 Description
AND APPLICATIONS DIE SIZE: 28.3X16.5 mils (720x420 µm) DIE THICKNESS: 2.6 mils (65 µm) BONDING PADS:.
LP3000 Key Features
- 33.5 dBm Output Power at 1-dB pression at 18 GHz
- 7 dB Power Gain at 18 GHz
- 30.5 dBm Output Power at 1-dB pression at 3.3V
- 45% Power-Added Efficiency
- DESCRIPTION AND