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MM912F634 - Integrated S12 Based Relay Driver

Datasheet Summary

Description

6 2.2 MCU Die Signal Properties

Features

  • 16-Bit S12 CPU, 32 kByte FLASH, 2.0 kByte RAM.
  • Background Debug (BDM) & Debug Module (DBG).
  • Die to Die bus interface for transparent memory mapping.
  • On-chip oscillator & two independent watchdogs.
  • LIN 2.1 Physical Layer Interface with integrated SCI.
  • www. DataSheet4U. net Six digital MCU GPIOs shared with SPI (PA5…0).
  • 10-Bit, 15 Channel - Analog to Digital Converter (ADC).
  • 16-Bit, 4 Channel - Timer Module (TIM16B4C).

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Datasheet Details

Part number MM912F634
Manufacturer Freescale Semiconductor
File Size 4.47 MB
Description Integrated S12 Based Relay Driver
Datasheet download datasheet MM912F634 Datasheet
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Freescale Semiconductor Advanced Information Document Number: MM912F634 Rev. 5.0, 11/2010 Integrated S12 Based Relay Driver with LIN The MM912F634 is an integrated single package solution that integrates an HCS12 microcontroller with a SMARTMOS analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application specific functions, including a LIN transceiver. Features • 16-Bit S12 CPU, 32 kByte FLASH, 2.0 kByte RAM • Background Debug (BDM) & Debug Module (DBG) • Die to Die bus interface for transparent memory mapping • On-chip oscillator & two independent watchdogs • LIN 2.1 Physical Layer Interface with integrated SCI •www.DataSheet4U.
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