Download MB84VD23381EF Datasheet PDF
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MB84VD23381EF Description

) FUJITSU SEMICONDUCTOR DATA SHEET DS05-50301-1E Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM CMOS 64 M (×16) FLASH MEMORY & 16 M (×16) Mobile FCRAMTM MB84VD23381EF-85.

MB84VD23381EF Key Features

  • Power Supply Voltage of 2.7 V to 3.0 V for FCRAM
  • Power Supply Voltage of 2.7 V to 3.3 V for Flash
  • High Performance 85 ns maximum access time (Flash) 85 ns maximum access time (FCRAM)
  • Both VCCf and VCCs must be the same level when either part is being accessed and VCCf can be 2.4 V during standby state
  • Operating Temperature -30 °C to +85 °C
  • Package 101-ball FBGA
  • FLASH MEMORY
  • Simultaneous Read/Write Operations (FlexBankTM) Two virtual Banks are chosen from the bination of four physical banks Ho
  • Minimum 100,000 Write/Erase Cycles
  • Sector Erase Architecture Sixteen 4 K words and one hundred twenty-six 32 K word sectors. Any bination of sectors can be