LB2S Datasheet | Good-Ark Semiconductor

Features - Low Profile: Typical height of 1.4mm - Ideal for automated placement - High surge current capability - Solder Dip 260℃，10seconds Mechanical Data - Case:SOPA-4 Epoxy meets UL-94V-0 Flammability rating - Terminals:Matte tin plated ldads, solderable per J-STD-002B and JESD22-B102D - Polarity:As markde on body LB2S thru LB10S Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier Reverse Voltage 200 and 1000V Forward Current 0.8A _ _ Maximum Ratings & Electrical Characteristics Ratings at 25℃ ambient temperature unless otherwise specified. Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Symbol VRRM VRMS VDC LB2S 200 140 200 Maximum Average forward output rectified current on glass-eposy P.C.B IF(AV) on aluminum substrate Peak forward surge current 8.3 ms single sine-wave IFSM superimposed on rated load (JEDEC Method) Rating for fusig (t<8.3ms) I2t Maximum instantaneous forward voltage drop VF per diode at 0.4A Maximum DC reverse current at TA=25℃ IR rated DC blocking voltage per leg TA=125℃ Typical thermal resistance per leg (Note 1) RθJA RθJL Operating junction temperature range Storage temperature range TSTG Notes: 1. Device mounted P.C.B with 0.47x0.47''(12mmx12mm) Copper Pads. 2. JEDEC registered values LB4S 400 280 400 LB6S 600 420 600 0.8 1.0 3...