Datasheet4U Logo Datasheet4U.com

GS8170LW72C-300 - (GS8170LW36C / GS8170LW72C) Late Write SigmaRAM

Download the GS8170LW72C-300 datasheet PDF (GS8170LW36C included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for (gs8170lw36c / gs8170lw72c) late write sigmaram.

Description

200 MHz

GS8170LW36/72 SigmaRAMs are built in compliance with the SigmaRAM pinout standard for synchronous SRAMs.

They are 18,874,368-bit (18Mb) SRAMs.

Features

  • Late Write mode, Pipelined Read mode.
  • JEDEC-standard SigmaRAM™ pinout and package.
  • 1.8 V +150/.
  • 100 mV core power supply.
  • 1.8 V CMOS Interface.
  • ZQ controlled user-selectable output drive strength.
  • Dual Cycle Deselect.
  • Burst Read and Write option.
  • Fully coherent read and write pipelines.
  • Echo Clock outputs track data output drivers.
  • Byte write operation (9-bit bytes).
  • 2 user-programmable chi.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (GS8170LW36C_GSITechnology.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number GS8170LW72C-300
Manufacturer GSI Technology
File Size 946.36 KB
Description (GS8170LW36C / GS8170LW72C) Late Write SigmaRAM
Datasheet download datasheet GS8170LW72C-300 Datasheet

📁 Similar Datasheet

  • GS810C - Microprocessor Reset Monitors (Vishay Siliconix)
  • GS816118 - (GS816118 - GS816136) Sync Burst SRAMs (GSI)
  • GS816118B - (GS816118B - GS816136B) Sync Burst SRAMs (GSI)
  • GS816132 - (GS816118 - GS816136) Sync Burst SRAMs (GSI)
  • GS816132B - (GS816118B - GS816136B) Sync Burst SRAMs (GSI)
  • GS816136 - (GS816118 - GS816136) Sync Burst SRAMs (GSI)
  • GS816136B - (GS816118B - GS816136B) Sync Burst SRAMs (GSI)
  • GS8161E18 - (GS8161E18 - GS8161E36) Sync Burst SRAMs (GSI)
  • GS8161E32 - (GS8161E18 - GS8161E36) Sync Burst SRAMs (GSI)
  • GS8161E36 - (GS8161E18 - GS8161E36) Sync Burst SRAMs (GSI)
Other Datasheets by GSI Technology

Full PDF Text Transcription

Click to expand full text
GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package • 1.8 V +150/–100 mV core power supply • 1.8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM™ Functional Description 200 MHz–333 MHz 1.8 V VDD 1.
Published: |