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GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D)
100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp Features
• IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 100-lead TQFP and 165-bump BGA packages • RoHS-compliant 100-lead TQFP and 165-bump BGA packages available
512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.
GS88118B Datasheet
