BY228
Overview
- High temperature metallurgically bonded construction
- Glass passivated cavity-free junction
- 2.5 ampere operation at TA=50°C with no thermal runaway
- Typical IR less than 0.1µA
- Hermetically sealed package
- Capable of meeting environmental standards of MIL-S-19500
- High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension P A T E N T E
- 0 (25.4) MIN 0.250 (6.3) 0.170 (4.3) DIA.
- 300 (7.6) MAX.
- 052 (1.32) 0.048 (1.22) DIA. 1.0 (25.4) MIN
